Views: 30 Author: Site Editor Publish Time: 10-05-2021 Origin: Site
Nowadays, with the development of the industry and changes in market demand, ceramic materials have been more and more used. However, ceramic materials have high hardness and brittleness, and molding is very difficult, especially for micropores. However, as a flexible processing method, laser has demonstrated extraordinary capabilities in ceramic substrate processing technology. Because of the high laser power density and good directivity of the laser cutting machine, laser drilling is generally used for ceramic thin plates. Next, Leapion Laser will share the application of laser cutting machine in ceramic circuit board.
1. The ceramic substrate has a compact structure and a certain degree of brittleness. Although it can be processed by ordinary mechanical methods, there are stresses during the processing. Especially for some thin ceramic sheets, it is very easy to crack. This makes the processing of ceramic substrates a difficult point for a wide range of applications.
2. Compared with glass fiber board, ceramic substrate is easy to break. Compared with ordinary pcb board, the process is much more difficult and requires higher process technology requirements.
One of the applications of laser cutting machine in ceramic production is laser drilling.
At present, ceramic-based circuit boards generally use laser drilling methods. Laser ceramic drilling generally uses pulsed lasers or quasi-continuous lasers (fiber lasers). The laser beam is focused on the workpiece placed perpendicular to the laser axis through the optical system, and the The laser beam with energy density (10*5-10*9w/cm*2) melts and vaporizes the material. An airflow coaxial with the beam is ejected by the laser cutting head, and the melted material is blown out from the bottom of the incision. The through holes are gradually formed.
1. The cutting speed is fast, the cutting quality is good, the cutting seam is small, the deformation is small, the cutting surface is smooth, flat and beautiful, without subsequent processing.
2. The cutting precision is high, and it is more suitable for the processing of precision parts and the cutting of various fine crafts.
3. The ceramic circuit board through the laser drilling process has the advantages of high ceramic and metal bonding, no shedding, blistering, etc., to achieve the effect of growing together, high surface flatness, and roughness between 0.1μm and 0.3μm. The laser drilling aperture is 0.15mm-0.5mm, even 0.06mm.
There are mainly two types of ceramic circuit board cutting: waterjet cutting and laser cutting. Currently, fiber lasers are mostly used for laser cutting on the market. Fiber laser cutting ceramic circuit boards has the following advantages:
1. High precision, fast speed, narrow cutting seam, small heat-affected zone, smooth cutting surface without burrs.
2. The laser cutting head will not touch the surface of the material and will not scratch the workpiece.
3. The slit is narrow, the heat-affected zone is small, the local deformation of the workpiece is extremely small, and there is no mechanical deformation.
4. The processing flexibility is good, it can process any graphics, and it can also cut pipes and other profiled materials.
5. Laser is a non-contact processing tool, which has obvious advantages over traditional processing methods in cutting process, and plays a very important role in the processing of ceramic substrate PCB.
For more information and professional questions about laser cutting machines, please contact Leapion Laser.
