banner-video
leapion news

Site Search

Contact us

Latest news

What are the application advantages of laser marking machines in the semiconductor field?

Views: 25     Author: Site Editor     Publish Time: 12-11-2021      Origin: Site

Inquire

With the development of laser technology, the application fields of laser marking machines have become more and more extensive, especially in industries that require relatively high marking accuracy. There are also many places where laser marking machines are used in the semiconductor field, such as wafer-level marking, marking the surface of the package, marking the serial number of the wafer, and so on. Next, Leapion Laser shares the application advantages of laser marking machines in the semiconductor field.

What are the application advantages of laser marking machines in the semiconductor chip industry? details as follows:

1. The laser beam pattern is good, the electro-optical conversion efficiency is high, and the energy consumption is well reduced.

2. Long service life, suitable for long-term operation on site.

3. The switch is fast and stable, suitable for circuit modulation and output, and is convenient for smooth operation.

4. The anti-counterfeiting is strong, and the marking method of laser marking makes the product not easy to be imitated and changed.

5. The engraving accuracy is high, the line width of the items engraved by the laser marking machine can reach 0.04mm, and the marking is clear and beautiful. Laser marking can be used to print a large amount of content on a small material.

Applications of laser marking machines in the semiconductor industry include:

1. Wafer-level marking

Wafer-level marking is mainly applied to the wafer marking on the chip of each chip on the back of the wafer to ensure the traceability of each chip, and then cut into individual chips after marking.

When the wafer is in the process of the marking machine, the wafer has been completed and the wafer is already very valuable. Therefore, higher requirements are put forward on the marking equipment, which are mainly reflected in:

1) Chips tend to be thinner and lighter. Different materials need to be marked with depth control, and the marked fonts are clear;

2) The smaller the chip size, the larger the positioning accuracy and font size;

3) The transfer and transportation of thin wafers during the marking process becomes very difficult, and how to handle this process becomes crucial.

2. After the semiconductor is packaged, mark the package surface, mark the serial number of the chip, etc.

3. With the increase in semiconductor market demand, it is foreseeable that the rapid development of the semiconductor chip industry will promote the application and development of laser marking machines, further expand the scope of use of marking machines, and promote the overall development of laser marking technology.

If you want to know other information and professional questions about laser marking machine, please consult Leapion laser, Leapion laser 7×24 hours online service.


Related videos

Contact Us

  Tel : +86-531-88982620
  WhatsApp:8616652002951
  Email:Inquiry@leapion.com

Quick Navigation

Machines

Copyright  2023 Shandong Leapion Machinery Co,.Ltd.  All Rights Reserved.