Views: 11 Author: Site Editor Publish Time: 01-23-2022 Origin: Site
Laser drilling technology is relatively widely used in the PCB industry. Compared with the traditional PCB drilling process, the laser not only has a faster processing speed on the PCB, but also realizes small holes, micro holes and invisible holes below 2μm that cannot be achieved by traditional equipment. drilling. Today, Leapion laser is introduced.
At present, the PCB industry is gradually developing in the direction of thinning, high integration and high precision. The traditional process has different problems such as burrs on the edges, dust, stress, vibration, and inability to process curves.
In the PCB manufacturing process, drilling is one of the most important processes, and the PCB board has very high requirements for holes. In the field of PCB, the application advantages of laser drilling technology are gradually highlighted.
Laser precision drilling is to reduce the spot diameter to micron level, so as to obtain high laser power density, and laser drilling can be carried out in almost any material.
1. Laser drilling technology also has the advantages of high coherence, high directionality, high brightness, high monochromaticity and other characteristics of laser, showing incomparable advantages in addition to mechanical drilling.
2. The laser beam energy density is high, the operation speed is fast, and it will not have much impact on the parts that are not irradiated.
3. The area affected by laser drilling is small, so that the deformation of the workpiece caused by heat is minimal. It can punch holes on high hardness, brittle or soft materials, with small hole diameter, fast processing speed and high efficiency.
4. As a very convenient and flexible processing method, the laser beam can be used to change, guide and focus the direction, and can be used to cooperate with the numerical control system to process various workpieces, which improves the processing quality and production efficiency.
CO2 laser processing is a widely used laser processing method in PCB drilling.
Its operating principle is: CO2 gas can generate practical pulsed infrared laser when the power is increased and the discharge time is kept unchanged. It has penetrability and can penetrate most organic materials.
The application of CO2 laser in the production of industrial micro-vias in printed circuit boards requires the diameter of micro-vias to be greater than 100 μm (Raman, 2001). With regard to the fabrication of these large apertures, CO2 lasers have high productivity due to the very short punching time required for CO2 laser fabrication of large apertures.
An application that utilizes the small beam size and low stress properties of UV lasers is drilling, including through holes, microvias, and blind and buried vias. Ultraviolet laser systems drill holes by cutting a focused vertical beam straight through the substrate. Depending on the material used, holes as small as 10 μm can be drilled.
Ultraviolet laser technology is widely used in the production of micro-holes with a diameter of less than 100 μm. With the use of miniature circuit diagrams, the aperture can even be less than 50 μm.
The development of the PCB industry has gradually driven the development of laser fine technology, bringing more development opportunities to the laser processing industry. Laser cutting machines, laser marking machines, and laser welding machines are all widely used in the PCB industry.
For more information on laser machines, please follow Leapion Laser.
